New ANSYS Cloud to accelerate innovation process for engineers

Elly Yates-Roberts
By Elly Yates-Roberts on 08 February 2019
New ANSYS Cloud to accelerate innovation process for engineers

US-based software company ANSYS has launched the ANSYS Cloud to help engineers innovate faster and to expedite speed to market. The solution leverages Microsoft Azure’s computing services to provide high performance computing with additional encryption for enterprise-level security in the cloud. 

ANSYS Cloud enables engineers to obtain high-fidelity simulation results and evaluate design variations quicker, improving business agility. Engineers can also access vast quantities of cloud compute resources to increase simulation throughput and solve complex models more easily. 

The solution is flexible to use Azure data centres worldwide that meet varying data privacy requirements. 

"ANSYS Cloud puts the power of on-demand hardware and software delivered from the cloud in the hands of ANSYS customers to tackle their largest simulation models and provide unprecedented insights into product designs," said Navin Budhiraja, vice president and general manager of Cloud and Platform Business at ANSYS. 

"ANSYS Cloud uniquely combines ANSYS software with Microsoft Azure services and HPC infrastructure to create completely seamless cloud access, while still providing the robust, secure and high-performance simulation technology our customers expect."

Small and medium-sized businesses can access the same simulation throughput available to large engineering enterprises. Larger organisations can also tap into ANSYS Cloud to satisfy peak demand when their on-premises systems are at capacity.

“Organisations around the world recognise Microsoft Azure as a trusted partner for scalable cloud infrastructure and services,” said Navneet Joneja, head of product for Azure Compute and Messaging at Microsoft. “We are pleased to see ANSYS bring our mutual customers faster time to results through easier access to on-demand HPC on Azure directly from within ANSYS applications."

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