Siemens and Bridg partner to develop Digital Twin technologies

Elizabeth Robinson
By Elizabeth Robinson on 05 February 2018
Siemens and Bridg partner to develop Digital Twin technologies

Siemens and Bridg have partnered to develop Digital Twin technologies for the semiconductor industry.

Microsoft partner and product lifecycle management (PLM) company Siemens will provide its software portfolio to enable smart sensor consortium Bridg’s research and development activities.

The partnership will help establish the first digital enterprise solution for semiconductor manufacturing at the Bridg wafer fabrication facility located at NeoCity in Osceola County, Florida.

Siemens’ digital enterprise solutions enable manufacturing companies to streamline and digitalise their business process and integrate suppliers into the mix. Manufacturers in the semiconductor industry can use this digital enterprise solution to help improve manufacturing throughput, improve product quality and reduce costs.

“The opportunity for Bridg to team with Siemens to lead the semiconductor industry in the digital mapping of the device building blocks associated with the manufacturing of advanced microelectronics is tremendous,” stated Chester Kennedy, chief executive officer, Bridg. “This programme will establish digital duplicates for model-based systems that lay the foundation for semiconductor design for manufacturing. Partners like Siemens help us develop and provide commercialisation infrastructure, as well as the capability for proof of concept, custom development and pilot production. This also leverages the existing Siemens relationship with our visionary stakeholder, the University of Central Florida, and further solidifies Siemens’ commitment to our region. We look forward to working with Siemens to be the global leaders in the digital transformation of semiconductor manufacturing.”

Through this partnership, the new Bridg digital enterprise site will feature the complete Siemens PLM portfolio, ranging from requirements management, product design, simulation, manufacturing and yield management to product performance analytics.

“Bridg is in a unique position to advance innovation in the semiconductor industry as well as other industries with their smart manufacturing wafer fabrication facility dedicated to new product launch in the IoT segment,” said Rob Rudder, vice president of Siemens PLM software. “Siemens is proud to partner with Bridg and provide our digital enterprise solution to help accelerate innovation in the manufacturing development of advanced technologies in smart sensors.”

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